About Plasma

What Is Plasma?

When matter is continually supplied with energy, its temperature increases and it goes from the solid through the liquid to the gaseous state, cIf the energy input is continued, the atomic shell breaks down and charged particles are created (negatively charged electrons and positively charged ions). This mixture is referred Briefly: Change of state as energy is added: solid =>liquid =>gas=>plasma. In nature, plasma can be found for example in lightning, auroras, flames and the sun. Artificially produced plasma is found in neon tubes, during welding and in flash bulbs, among others..

Visualization using test Ink on Acrylic, in animation below:

Low Pressure Plasma 

Low-pressure plasma offers a wide range of options for surface modification, for example fine-cleaning of contaminated components, plasma activation of plastic parts, etching of PTFE or silicon, and coating of plastic parts with PTFE-like layers. This means that low-pressure plasma is used in a great variety of industries when it comes to combining materials or changing the surface characteristics in a directly targeted manner.


Atmospheric Pressure Plasma

Atmospheric pressure plasma is suitable for a wide range of applications. Primarily, however, the systems are intended for local pretreatment of different surfaces, e.g. cleaning and activation of polymers, metals, ceramic, glass and hybrid materials. But the Plasma Jet process can also be used for coating. Thanks to their unique design, atmospheric pressure plasma systems by Diener electronic are suitable for use with robots and for integration in existing, automated production lines.


Our Product Can be Applied

Plasma technology can be applied in areas for e.g. to bond materials together, or to change their surface properties to suit your needs. For example, to prepare the surface of objects to be easily glued to each other. The 4 main applications are:

Cleaning Surface Treatment: Ultra-fine contaminations not visible to the naked eye are found on all surfaces. Almost always, these contaminations must be removed as a prerequisite for faultless further surface treatment.

Activation Surface : Good wettability is a prerequisite for the adhesion of binding partners in painting, gluing, printing or bonding. Wetting is not only impaired by contamination with oil and grease; many materials have surfaces which, even if clean, cannot be sufficiently wetted by many liquids such as adhesives and paints. The liquid rolls off. Also after curing or drying, it will not adhere to the surface. This is due to a low surface energy of the substrate. Substances with a low surface energy wet those with a high surface energy, but not vice versa. The surface energy of the applied liquid, also known as surface tension in the case of liquids, must therefore be lower than that of the substrate.

Coating: With plasma, components can be tempered with various coats. This is done by supplying gaseous and liquid starting substances. The raw materials, mostly short-chain monomers, crosslink in the plasma to form long-chain polymers. The selection of raw materials determines the coat characteristics:

  • Hydrophobic (water repellent)
  • Hydrophilic (water attracting / wetting)
  • Scratch protection, corrosion protection
  • Carbon coats
  • Barrier / Diffusion barrier
  • PTFE-like| Anti-friction coats / Nonstick coats
  • Adhesion promoter / Primer
  • Water / steam barrier
  • Metallization
  • Nano-silver

Plasma Etching: Is the removal of material from surfaces via plasma processes. It is also described as dry etching because conventional etching processes are carried out with wet chemical methods using aggressive acids. The plasmas of the process gases change the aggregate state of the material to be etched from solid to gaseous, and the vacuum pump extracts the gaseous products. Masks can be used to etch partial areas or structures only. Plasma etching is only carried out in low-pressure plasma because a longer treatment duration is necessary to achieve noticeable etching effects, and because most etching gases can only be used in low-pressure plasma. Plasma etching is suitable for a wide range of applications. To tailor the etching process optimally to the application, choose from a variety of process gases and select one of three basic etching processes.

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